Employer Navigation

Intern, Package Design Engineering (PIE) profile banner profile banner

Intern, Package Design Engineering (PIE)

The Programme 

Micron’s vision is to transform how the world uses information to enrich life for all. ​ Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. 

Project Title : Understand and enhance the Assembly New Product Introduction (NPI) process through data analysis 
Description :  Smart manufacturing (SM) is a term generally applied to a movement in manufacturing practices towards integration up and down the supply chain, integration of physical and cyber capabilities, and taking advantage of advanced information for increased efficiency and flexibility. SM leverages a vast variety of data, or “big data,” and applies “big data analytics” for continuous improvement and capability breakthrough. In this project, student will be exposed to engineering data and its application to real engineering activities.

He/She will also gain 1st hand experience of Backend Assembly operations, learn the New Product Introduction Process  and work with highly professional cross functional teams. Student should preferably has big data analysis experience and has a keen interest in data science and semiconductor. 

What you will do 

Scope : Compile and analyze vast engineering and manufacturing data to support the NPI process. Collaborate with cross functional team, namely Product Integration Engineering (PIE), Central Engineering Module(CEM) and Network Engineering, to understand the key Backend Assembly process, data source and interpretation. Student will be able to learn the entire new product qualification process, how to use statistical tools, as well as perform Design of Experiment (DOE) to tackle issues relating to new product qualification. 

Deliverable : Two key deliverables 

  • Establish metric dashboard to track the health of the NPI process.
  • Establish system template to improve the efficiency of data mining and reporting.  

Required Skills and Abilities  

  • Able to commit for at least a 3-month full-time internship. Prefernce would be to be able to commit for a 5-6 month full-time internship 
  • Currently studying, Computer Engineering, Mechanical Engineering, Materials Engineering or Electrical Engineering 
  • Must be familiar with Progamming and Big Data Analysis courses 
  • Proficient in SQL and Python 
Closing in 7 hours
Closing in 7 hours
  • Job type:Internships
  • Disciplines:

    Engineering Electrical, Engineering Mechanical

  • Citizenships:

  • Locations:

    Singapore (Singapore)

  • Closing Date:18th Apr 2021, 6:00 pm

Search

Enter an employer or university you want to find in our search bar.